Will it surpass Qualcomm? MediaTek announces high-performance chipset "Dimensity 8000" for 5G smartphones

Will it surpass Qualcomm? MediaTek announces high-performance chipset "Dimensity 8000" for 5G smartphones

Dimensity 8000 Series Incorporating Flagship-class Advanced Technology

MediaTek, which has been increasing its share in the US Android smartphone market, will capture the largest share in the fourth quarter of 2021 reportedly did.

MediaTek has announced three new products, including the Dimensity 8100 and Dimensity 8000 system-on-chip (SoC) with flagship-level technology for premium 5G smartphones.

The new Dimensity 8000 series incorporates advanced technology from MediaTek's powerful flagship Dimensity 9000 platform.

The Dimensity 8100 features 4 premium Arm Cortex-A78 cores running up to 2.85GHz, while the Dimensity 8000 features 4 Cortex-A78 cores running up to 2.75GHz.

Both chips combine Arm Mali-G610 MC6 GPU with MediaTek's HyperEngine 5.0 gaming technology for superior power efficiency to extend playtime and best-in-class frame rates (170fps on Dimensity 8100) , 140fps at Dimensity 8000).

Qualcomm surpasses? MediaTek 5G Announced high-performance chipset

In addition, it supports up to 200MP camera and video recording in 4K60 HDR10+, supported by MediaTek's latest noise reduction and AI-based deblurring technology in extreme low-light environments.

Avi Greengart, president of Techsponential, commented on the launch:

"MediaTek's massive investment in 5G has dramatically increased the global distribution of smartphone SoCs in the middle tier, with the Dimensity 9000 carving out the flagship market.

With the Dimensity 8000, MediaTek gives smartphone vendors more options to balance performance and price while offering flagship-level gaming and AI features."

The company's 5G family also includes a 6nm process Dimensity 1300 lineup

In addition, the company's 5G family also includes a 6nm process Dimensity 1300.

Octa-core CPU consisting of ultra-core Arm Cortex-A78 up to 3GHz, 3 Arm Cortex-A78 super cores, 4 Arm Cortex-A55 efficiency cores and Arm Mali-G77 GPU for the latest AI features, MediaTek Integrated APU 3.0.

Smartphones powered by Dimensity 8100, Dimensity 8000 and Dimensity 1300 will hit the market in the first quarter of 2022, powering an amazing new era of 5G devices from the world's biggest smartphone brands. .

Related information: https://i.mediatek.com/mediatek-5g/jp

Composition / Ara